Just for naming one for example a compliant layer is added in the package that allows the balls to physically move in relation to the package. Anyway, different techniques has already been applied to diminish this disadvantage. Mechanical or thermal stress can fracture solder joints.
Noncompliant connections:Since connection is made of solder balls instead of leads, this elements don’t have flex capability therefore they are not mechanically compliant. Also provides superior performance at high speed. Better electrical performance compared to other IC packaging technologies. Increased performance:As a result of all advantages mentioned before combined. Better heat conduction:Less leads distances ensures less thermal resistance also providing as result better flow and conduction heat in between the two components that allows better conduction heat through the board. Lower inductance leads:unwanted inductance is directly proportional to distance, so less lead length provide us less unwanted inductance. Higher pin density :We can now have hundreds of pins on a single package without compromising quality of the soldering neither package reliability. We have strong reasons for choosing this technology, most of them are mentioned in the list below: Request BGA Assembly Quote Now BGA Technology Advantages Metal-core allows to use more circuitry than other options mentioned, mini-circuitry can be placed inside the BGA package, this an a addition to the regular number of balls and circuitry already there. Ceramic packages are vastly used for telecommunications, device-under-test equipment applications and laptops. Lower cost of plastic bodies make them more commonly used. 
Through-hole plated vias use allows several layer of interconnection.īGAs are available in plastic or ceramic bodies, another option is metal-core BGA. Conductors are traces etched in copper foil bonded to a polymer substrate. When more flexibility is required polyimide tape is also available. Commonly uses fiber-reinforced material as BT substrate (Bismaleimide Triazine). The BGA ic package contains a PCB on where the silicon die is placed, this is a high quality PCB like the one used for motherboards.
Micro-BGAs has pitches of 0.6, 0.4 and even 0.3 mm.Įach BGA would be identified by the number of sockets that contain, for example BGA 370 means 370 sockets. One millimeter pitch is standard BGA if we go smaller than that we’re talking about micro-BGA. The balls pitch, distance from the center of one ball to the center of the next defines what type of BGA technology we are using. This provides higher prototype SMT assembly reliability and allows to reach smaller balls pitch which increases the density of miniaturization.
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